1.案例背景/G^~Û
sbbs.3c3t.comb!3I~2
某功能模块在用户端出现功能失效，经返厂检修，发现该模块上的一片IC输出异常，经更换IC后，功能模块恢复正常。/G^~Û
sbbs.3c3t.comb!3I~2
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2.分析方法简述/G^~Û
sbbs.3c3t.comb!3I~2
对样品进行外观观察，未发现明显异常。/G^~Û
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sbbs.3c3t.comb!3I~2 经X-RAY无损检测，未发现明显异常。/G^~Û
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通过C-SAM扫描发现了IC内部存在分层现象。/G^~Û
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图5.NG样品C-SAM图片/G^~Û
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通过IV曲线测试，发现引脚间存在漏电通道。/G^~Û
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图6.NG样品IV曲线图/G^~Û
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DE-CAP后，利用SEM/EDS进行分析，确认了引脚间存在银迁移问题。/G^~Û
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表1.开封后的NG样品内部EDS测试结果(Wt%)/G^~Û
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3.结论/G^~Û
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sbbs.3c3t.comb!3I~2
IC内部存在分层，由于水汽的入侵，加上集成电路各引脚之间存在电位差，导致了引脚间的银迁移，从而在引脚间形成微导通电路，致IC输出异常。/G^~Û
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4.参考标准/G^~Û
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GJB 548B-2005 微电子器件失效分析程序-方法5003。/G^~Û
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IPC-TM-650 2.1.1-2004手动微切片法。/G^~Û
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GB/T 17359-2012 电子探针和扫描电镜X射线能谱定量分析通则。/G^~Û
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