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[报告] Ag迁移致集成电路输出异常失效分析 [复制链接]

meixinjiance
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  • 技术员
  • 26
  • 78
  • 2015-03-11
1#
t T
发表于 2015-03-18 11:35 |只看楼主
1.案例背景t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
     某功能模块在用户端出现功能失效，经返厂检修，发现该模块上的一片IC输出异常，经更换IC后，功能模块恢复正常。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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2.分析方法简述t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
     对样品进行外观观察，未发现明显异常。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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     经X-RAY无损检测，未发现明显异常。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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     通过C-SAM扫描发现了IC内部存在分层现象。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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图5.NG样品C-SAM图片t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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     通过IV曲线测试，发现引脚间存在漏电通道。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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图6.NG样品IV曲线图t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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DE-CAP后，利用SEM/EDS进行分析，确认了引脚间存在银迁移问题。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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表1.开封后的NG样品内部EDS测试结果(Wt%)t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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3.结论t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
IC内部存在分层，由于水汽的入侵，加上集成电路各引脚之间存在电位差，导致了引脚间的银迁移，从而在引脚间形成微导通电路，致IC输出异常。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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4.参考标准t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

     GJB 548B-2005 微电子器件失效分析程序-方法5003。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

     IPC-TM-650 2.1.1-2004手动微切片法。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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     GB/T 17359-2012 电子探针和扫描电镜X射线能谱定量分析通则。t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­

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84362020gwh
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  • 高级工程师
  • 1938
  • 2696
  • 2012-03-08
检测工程师勋章优秀会员勋章爱心志愿者网校学员
2#
t T
发表于 2015-03-18 20:22 |只看该用户

这是做什么的t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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84362020gwh
头像

  • 高级工程师
  • 1938
  • 2696
  • 2012-03-08
检测工程师勋章优秀会员勋章爱心志愿者网校学员
3#
t T
发表于 2015-03-25 09:44 |只看该用户

快来看看了t‡Ù¾šú¯ -bbs.3c3t.comÎ5º»Ky,­
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